Ministry of Economic Affairs, Institute of Smart Electronics
Chipbond Technology Corporation
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Chipbond Technology Corporation

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Chipbond Technology Corporation (hereinafter referred to as Chipbond) was founded in July 1997. As a downstream packaging and testing service provider in the semiconductor industry, Chipbond has its headquarters in Hsinchu Science Park in Taiwan. Since then, we have expanded our operations to six locations and currently employ approximately 5,200 people. We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.In 2025, we will establish a subsidiary in Penang "Chipbond Technology Malaysia Sdn Bhd." We will provide the best job opportunities and hope to recruit more talents who are interested in the semiconductor packaging and testing industry.

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